The Dimensity 8000 family elevates premium to new dimensions in our incredible new 5G smartphone portfolio. Built using the highly advanced TSMC N5 (5nm-class) production process it gives users best-in-class power-efficiency – particularly advantageous in high frame rate gaming.
Employing the Dimensity 9000’s groundbreaking technology world-firsts, these chips feature our latest Imagiq 780 photo and video capture engine, our new 5th generation AI processor, fresh HyperEngine 5.0 gaming enhancements, and a technology-leading Release-16 5G modem; all built into this impressive ultra-efficient chip.
- Super Cores - 4x Arm Cortex-A78
- Arm Mali G610 MC6 GPU
- Efficiency Cores - 4x Arm Cortex-A55
- UFS 3.1 storage and quad-channel LPDDR5
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Arm Cortex-A78 up to 2.85GHz Up to 20% GPU Frequency Boost in Games
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Arm Cortex-A78 up to 2.75GHz
In Game, Every Millisecond Matters
Giving gamers a comprehensive suite of gaming-related optimizations to ensure every millisecond matters. This new 5th generation features exclusive AI-VRS and MediaTek Intelligent Display Sync 2.0, upgrading 5G and Wi-Fi networking, plus the lowest latency Bluetooth earbud connections, and much more.
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- Most powerful 5Gpixel/s ISP in its class
- 4K60 HDR10+ video capture
- 200MP camera support
- AI-Motion unblur
- AI-NR/HDR photos
- 2X lossless zoom
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Simultaneous dual camera HDR video recording
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HDR capture with three separate exposures per frame of video
Dual Wield Your Cameras
Ideal for sharing live experiences with friends, family, or fans, and vlogs – capture HDR video on two cameras simultaneously, whether front and rear at the same time, or using two different lenses to capture unique views on the same subject.
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Incredible Performance for Great HFR Gaming Experiences
Built using the TSMC N5 (5nm-class) production process, the Dimensity 8100 upgrades gaming with a super-fast octa-core CPU, and the latest Arm Mali-G610 graphics engine.
Gamers will experience smooth and fast frame rates in top titles while also enjoying up to 20% power savings over alternative competitor chips, allowing the play to go on and on!
Fastest, Clearest HDR Photos & Video in Any Situation
Using the latest MediaTek Imagiq 780 ISP, photobugs can enjoy the benefits of our latest HDR, AI-based noise reduction and anti-blur techniques that bring out clearer images and enhanced details, even in extreme low-light pictures and videography.
Unmatched 5G Technologies
Unmatched 5G technologies from the most advanced smartphone modem that’s built directly into the chip. Connect further, faster and with better power efficiency, so you can leave 5G on all day, every day.
- Latest Standard: 3GPP Release-16 5G modem
- MediaTek 5G UltraSave 2.0 power-saving enhancement suite including R16 WUS and SCell Dormancy
- 2CC Carrier Aggregation (200MHz)
- 5G+5G Dual SIM Dual Standby – 5G/4G+5G/4G connections
Massive Speed Boosts for Truly Next-gen AI Performance
MediaTek APU 580 has received a complete end-to-end design upgrade that maximizes AI performance efficiency at every pipeline step while also boosting performance, unlocking vast new opportunities for device makers to provide fresh experiences with cameras, video playback, and next-gen AI-driven apps.
2.75X speed boost over previous generation Dimensity
2.5X speed boost over previous generation Dimensity
Faster, Bigger HDR Displays that Always Impress
25% speed upgrade over previous generation chip means the Dimensity 8000 family always gives an impressive display that’s tempting to touch. Enjoy videos with the latest HDR and streaming technologies for incredible cinematic experiences.
- MediaTek Intelligent Display Sync 2.0
- CUVA HDR-vivid certified Android smartphone platform
- HDR10+ Adaptive support
- 4K AV1 media decoding
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120Hz WQHD+ & 168Hz Full HD+
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168Hz Full HD+
The Latest Connectivity
We’ve added the latest Wi-Fi 6E while also making sure it works flawlessly when you’re using Bluetooth earbuds to ensure network connections deliver excellent speeds and are always reliable.
- Wi-Fi 6E 2x2 with MediaTek Wi-Fi Fast Path technology
- Bluetooth 5.3
- New Wi-Fi/Bluetooth hybrid coexistence design
- Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio
- Beidou III-B1C signal support
What’s Inside
Process
TSMC N5 (5nm-class)
CPU
4x Arm Cortex-A78 Dimensity 8100 up to 2.85GHz | Dimensity 8000 up to 2.75GHz 4x Arm Cortex-A55
GPU
Arm Mali-G610 GPU MC6
MediaTek HyperEngine 5.0 Dimensity 8100 up to 20% frequency boost
AI
MediaTek APU 580Dimensity 8100 up to 25% frequency boost
Camera
MediaTek Imagiq 780 | 14-bit HDR-ISP fusion up to 5Gpixel/s | Up to 200MP Primary Camera | Twin camera, Tri-exposure HDR videography
Display
MediaTek MiraVision 780
168Hz Full HD+ Dimensity 8100 also offers 120Hz WQHD+ MediaTek Intelligent Display Sync 2.0
Audio
Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio
Connectivity
Wi-Fi 6E 2x2 and Bluetooth 5.3 | Wi-Fi/Bluetooth hybrid coexistence design
Memory
Quad-channel LPDDR5
Storage
UFS 3.1
Modem
3GPP Release 16 5G modem | MediaTek UltraSave 2.0 | 2CC Carrier Aggregation (200MHz) 5G NR
Customization
Dimensity 5G Open Resource Architecture ready
